Copper wiring
Wire interconnections within the package support the assembly of multiple components into a functional module.
System integration, from the inside out.
Understand the components, assembly approaches and design considerations behind compact, functional semiconductor systems.
SYSTEM-IN-PACKAGE
A complete electronic system within a package
System-in-Package is an electronic system or subsystem integrated and miniaturized through IC assembly technologies. It can combine multiple chips and components with different functions within a single package or module.
Typical elements include specialised processors, DRAM, flash memory, resistors, capacitors, inductors, filters, connectors, MEMS devices, sensors and pre-assembled packages.
This heterogeneous integration requires consideration of the electrical system, component arrangement, interconnections, shielding, thermal behaviour and testing approach.
ASSEMBLY CAPABILITIES
Established technologies, combined for the application
Flip chip packaging
Die-to-substrate interconnection is part of the assembly toolkit for compact, integrated devices.
Wafer-level packaging
Packaging at wafer level supports miniaturization across a range of electronic components.
Fan-out wafer-level packaging
Fan-out integration is one of the established assembly approaches used in advanced SiP development.
2.5D / 3D IC
Multi-die and stacked structures introduce additional layout, interconnection and system-design considerations.
Embedded chip packaging
Embedded-die structures provide another route to integrate multiple functions within a compact package.
Supporting processes
Surface-mount technology (SMT), encapsulation, shielding and interconnection assembly form part of the development approach.
APPLICATION AREAS
Find the relevant integration approach
Wireless connectivity & smart living
Remote control, home automation, energy applications, connected devices and smart living.
The Wireless SiP module brings a 2.4 GHz BLE transceiver and ARM Cortex-M0 processor into a compact package.
Explore Wireless SiPComputing & storage
Notebooks, tablets and compact computing products.
The Computing & Storage SiP module uses a double-sided structure with molded protection and NAND flash storage.
Explore Computing & Storage SiPPower electronics & smart mobility
Integrated power devices, intelligent power switches and driver applications.
Embedded multi-die integration brings power devices, drivers and associated functions into a compact package. BI’s broader SiP solutions also address smart bikes and automotive applications.
Explore Power SiPHealth, sensors & optical systems
Physiological signal sensing, health and fitness devices, and optical sensing.
The Sensor & Optical SiP module combines LEDs and a photo-die with optical molding and an embedded-die substrate.
Explore Sensor & Optical SiPBI’s wider application focus includes smart cities, mobile and IoT devices, high-performance computing, artificial intelligence, 5G communication and AR/VR sensing. Discuss the requirements of your specific application with our team.