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SiP product portfolio

Explore module families, compare key specifications and review application requirements. Original product references and technical details are presented together.

Wireless SiPComputing & Storage SiPPower SiPSensor & Optical SiP
Product family overview
Module familyIntegration focusDimensionsPackage / structure
Wireless SiPBLE + processor6.5 × 6.5 × 1.2 mmAoP / LGA
Computing & Storage SiPNAND flash, 120 / 240 GB22 × 42 × 1.8 mmMolded NGFF structure
Power SiPPower devices + driversContact BI for dimensionsEmbedded multi-die
Sensor & Optical SiPLEDs + photo-die5.5 × 4.2 mm footprintLGA / optical molding

Specifications are retained from BI Components’ existing product materials. Contact the team to confirm availability and the configuration for your application.

Wireless SiP module — BI Components product reference
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01 / PRODUCT FAMILY

Wireless SiP Module

Compact connectivity for a smarter, more connected world.

Applications

Remote control; health, fitness and medical devices; home automation and energy.

Features & specifications

  • 2.4 GHz BLE transceiver
  • ARM® Cortex-M0 32-bit processor
  • 256 kb embedded flash program memory
  • 16 kb RAM
  • Dimensions: 6.5 × 6.5 × 1.2 mm
  • Package: AoP, LGA
Computing & Storage SiP module — BI Components product reference
BI Components product referenceEnquire about this module
02 / PRODUCT FAMILY

Computing & Storage SiP Module

Integrated storage in a compact, double-sided architecture.

Applications

Notebooks and tablets.

Features & specifications

  • Dimensions: 22 × 42 × 1.8 mm
  • Double-sided structure within single-sided NGFF card thickness
  • Molded protection
  • NAND flash capacity: 120 GB / 240 GB
Power SiP module — BI Components product reference
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03 / PRODUCT FAMILY

Power SiP Module

Multi-die integration for power devices and intelligent drivers.

Applications

Integrated power devices and drivers; intelligent power switches combining driver, power switch, protection circuitry and diagnostic feedback; power analog applications.

Features & specifications

  • Metal lead frame
  • Multiple dies embedded in substrate
  • Double-sided redistribution layer (RDL) build-up
  • Small form factor packaging
  • Surface-mount technology on the substrate
  • Meets JEDEC MSL3 CLR requirements
Sensor & Optical SiP module — BI Components product reference
BI Components product referenceEnquire about this module
04 / PRODUCT FAMILY

Sensor & Optical SiP Module

Optical integration for compact sensing applications.

Applications

Notebooks and physiological signal sensing.

Features & specifications

  • Optical molding + EDS structure
  • 3 LEDs + 1 photo-die with wire bonding
  • 2-layer embedded-die substrate
  • LGA footprint: 5.5 × 4.2 mm
  • Molded protection with clean CPD

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