Engineering support across the complete system.

BI’s capabilities include system design, software development, module testing, and electrical and thermal simulation, alongside SiP manufacturing services.

Design, packaging and testing considered together

Our services support the development of smaller, higher-performance, lower-power and cost-effective end products. Select an area below to see the scope of engineering support.

ENGINEERING SERVICES

System co-design

Coordinate electronic, RF and package design around the requirements of the complete system.

Discuss system co-design

Scope of support

  • SiP electronic design automation (EDA)
  • RF circuit design
  • Antenna design
  • Shielding solutions
  • Substrate layout design
ENGINEERING SERVICES

Packaging consultancy

Evaluate package configuration, manufacturing processes and reliability requirements together.

Discuss packaging consultancy

Scope of support

  • Package selection and configuration
  • Design rule guidelines
  • Process capability
  • Reliability verification
ENGINEERING SERVICES

System test consultancy

Plan the tools, evaluation hardware and test approach needed to verify the final module.

Discuss system test consultancy

Scope of support

  • RF wafer probing
  • RF ATE platform
  • Evaluation board design and fabrication
  • Testing tooling design
  • Final test solution development

Discuss your semiconductor project

Share your application, package requirements and testing needs with our team.

Contact BI Components