Complete solutions. Practical engineering.
BI Components provides turnkey System-in-Package (SiP) and multi-chip module (MCM) solutions for customers developing high-performance electronic applications.
Our work brings together the disciplines involved in developing an integrated package: system design, manufacturing, packaging and testing. This complete perspective helps align the electronic architecture with the requirements of the final module.
SiP enables different components—including processors, memory, sensors and passive devices—to be assembled into a compact functional system. BI draws on established IC assembly capabilities to address applications across wireless communication, computing and storage, power electronics, and optical sensing.
Making integration more accessible
Custom SiP development has historically been associated with large companies addressing highly specific design challenges. BI was established with the goal of making this technology available to a broader range of customers, supported by comprehensive engineering services.
Working from your requirements
Product dimensions, application requirements, package configuration and verification needs all influence the integration approach. Our services cover system co-design, packaging consultancy and system test consultancy so that these considerations can be addressed together.
Review our engineering services
