INTEGRATED SEMICONDUCTOR SOLUTIONSSystem-in-Package.
System-in-Package.
Expertise from design
to final test.
Bi Components delivers turnkey System-in-Package (SiP) and multi-chip module (MCM) solutions, bringing design, manufacturing, packaging and testing together for high-performance applications.
BI COMPONENTS PTE. LTD.Integration at
the system level.
the system level.
Wireless connectivity · Computing & storage
Power electronics · Optical sensing
HEADQUARTERSSingapore
CORE TECHNOLOGIESSiP & MCM
PRODUCT FOCUSWireless, storage, power & sensing
DELIVERY SCOPEDesign through testing
PRODUCTS & MODULES
Full product portfolioIntegrated solutions for real applications
Our SiP modules combine established IC assembly technologies with application-specific integration. Explore the module families, key features and package dimensions below.
Computing & Storage SiP
- 120 GB / 240 GB NAND flash
- Double-sided module structure
- 22 × 42 × 1.8 mm
Power SiP
- Multi-die embedded substrate
- Double-sided RDL build-up
- Metal lead frame
ABOUT BI COMPONENTSA semiconductor partner
A semiconductor partner
with a complete perspective.
Headquartered in Singapore, Bi Components provides a full range of design, manufacturing, packaging and testing services for SiP and MCM applications. We work around each customer’s specifications to bring different components and technologies into a complete electronic system.
Our aim is to make advanced SiP integration accessible to a broader range of customers, with technical support across the development process.
Company profileSYSTEM-IN-PACKAGE TECHNOLOGYMultiple technologies.
Multiple technologies.
A single functional module.
SiP integrates an electronic system or subsystem within one package. A module may combine processors, DRAM, flash memory, MEMS devices, sensors, filters, connectors and discrete components.
BI’s assembly capabilities span copper wiring, flip chip, wafer-level and fan-out packaging, 2.5D/3D IC and embedded chip packaging.
Explore packaging technologies
ENGINEERING & MANUFACTURING SUPPORT
All servicesExpertise throughout development
System co-design
Coordinate electronic, RF and package design around the requirements of the complete system.
- SiP electronic design automation (EDA)
- RF circuit design
- Antenna design
- Shielding solutions
- Substrate layout design
Packaging consultancy
Evaluate package configuration, manufacturing processes and reliability requirements together.
- Package selection and configuration
- Design rule guidelines
- Process capability
- Reliability verification
System test consultancy
Plan the tools, evaluation hardware and test approach needed to verify the final module.
- RF wafer probing
- RF ATE platform
- Evaluation board design and fabrication
- Testing tooling design
- Final test solution development
APPLICATIONSConnecting technology
Connecting technology
with its purpose.
SiP solutions support applications in smart living, smart mobility, connected cities, computing and healthcare. Find the product families and engineering considerations relevant to your application.
Explore applications